High Performance Thermal Paste
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
| Model | HTK-002-U1 |
| Color | White |
| Specific Gravity | 2.37 |
| Viscosity/Flowability | Nonflowing |
| Thermal Conductivity | 0.8 watts/meter- °C |
| Volume Resistivity | 5.0 x 1015 |
| Dielectric Constant | 4.4 at 100k Hz |
| Dissipation Factor | 0.02 at 100k Hz |
| Dielectric Strength | 550 volts/mil; 21.7 kV/mm |