With enhanced thermally conductive noncuring compound, provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
Form | Non-Curing Compound |
Color | White |
Specific Gravity (g/ml) | 2.5 ± 0.2 |
Thermal Conductivity (W/m-K) | 1.0 |
Temperature Stability ( ) | -30 ~ 150 |
Weight (g) | 40 |
Packaging Information | |
Carton Size | 490 x 285 x 335 mm |
Units / Carton | 210 |
EAN Code | 471952013281 |
UPC Code | 884102002786 |