With enhanced thermally conductive noncuring compound, provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
| Form | Non-Curing Compound |
| Color | White |
| Specific Gravity (g/ml) | 2.5 ± 0.2 |
| Thermal Conductivity (W/m-K) | 1.0 |
| Temperature Stability ( ) | -30 ~ 150 |
| Weight (g) | 40 |
| Packaging Information | |
| Carton Size | 490 x 285 x 335 mm |
| Units / Carton | 210 |
| EAN Code | 471952013281 |
| UPC Code | 884102002786 |